Composite substrate

Epoxy fiberglass cloth board

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Copper Clad Laminate PZ-23(G)F

The product has: excellent color resistance in appearance; Excellent processing flatness and dimensional stability, suitable for punching and drilling; High and stable heat resistance The heat resistance of the product is increased from 20-30s at 260 ℃ to 20-30s at UL288 ℃, especially suitable for lead-free process, carbon ink printing and tin spraying process. Widely used in power substrate, household appliances, chargers, displays, industrial instruments, etc.

Classification:

Composite substrate

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Mr.Che +86-13280998681

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  • Product Description

  • ● Product description

    Standard

    IPC Standard

    IPC4101/10

    GB

    CEPCP(G)-23F

    Certification

    UL

    E249104

    VDE

    40044880

    CQC

    CQC07001021920

    ROHS、REACH

    PASS

     

    ● Product features

    The product has: excellent color resistance in appearance; Excellent processing flatness and dimensional stability, suitable for punching and drilling; High and stable heat resistance The heat resistance of the product is increased from 20-30s at 260 ℃ to 20-30s at UL288 ℃, especially suitable for lead-free process, carbon ink printing and tin spraying process. Widely used in power substrate, household appliances, chargers, displays, industrial instruments, etc.

     

    ● General characteristics

    Test Item

    Unit

    Test Method

    IPC-TM-650

    Treatment conditions

    Normative value

    (IPC-4101C)

    Typical value

     

    Peel strength of copper foil (1oz.)

     

    N/mm

     

    2.4.8

    125 ℃

    --

    1.70

    Float260 ℃/10s

    ≥ 1.05

    1.65

    thermal stress

    Sec

    2.4.13.1

    Float260 ℃/10s

    ≥ 10

    20(288 ℃)

    Bow/Warp

    %

    2.4.22.1

    A

    ≤ 1.5

    0.4/0.55

    bending strength

    N/mm2

     

    2.4.4

    Warp

    ≥ 242

    320

    Fill

    ≥ 172

    260

    Combustibility

    Rating

    UL94

    UL94

    UL94 V-0

    V-0

    surface resistivity

    MΩ

    2.5.17.1

    C- 96/35/90

    ≥ 104

    1.4 × 109

    volume resistivity

    MΩ-cm

    2.5.17.1

    C- 96/35/90

    ≥ 106

    3.3 × 109

    dielectric constant

    ―

    2.5.5.2

    Etched/@1 MHZ

    ≤ 5.4

    4.5

    dielectric loss

    ―

    2.5.5.2

    Etched/@1 MHZ

    ≤ 0.035

    0.025

    Arc resistance

    Sec

    2.5.1

    D-48/50 D-0.5/23

    ≥60

    120

    water absorption

    %

    2.6.2.1

    D-24/23

    ≤0.5

    0.08

    Compared with the tracking index CTI

    V

    IEC60112

    Etched/0.1%NH4CL

    ≥ 175

    300/600

    Note: Typical value reference: 1.6mm 1/0

     

    ● Purchasing information

    Nominal area size

    2060x 1230,1230x 1030 ,1220x 1020 (other sizes negotiated)

    Dimensional tolerance

    3/-0 mm.

    Plate thickness

    0.8mm 1.0mm 1.2mm 1.6mm

    Straight angle

    max. 3mm as difference from diagonal measurement

    Red flag

    PZ

    Thickness of copper foil

    18, 25, 35, 70 µm (other copper foil thickness negotiation)

     

     


     

Tag:

Copper Clad Laminate

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