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CEM-1 of copper clad laminate

PZ-23(G)F is a new type of PZ-23(G)F(UL:CEM-1) board developed by our company on the basis of the original PZ-23F board, combining the traditional CEM-1 board production process with self-innovation, adopting new plasticizing materials and high Tg epoxy resin, focusing on the requirements of PCB environmental protection lead-free welding and SMT automatic processing in recent years. This type of product has great quality advantages over the traditional board: 1. The heat resistance of the product has reached 288 ℃/30S or more, which is more than 20s higher than that of the traditional plate. 2. The warpage of the plate meets the IPC4101A(&le; 0.75%) standard, reaching and stabilizing below 0.5%, which is 0.3% lower than that of the traditional plate, reducing the bending probability of the plate during thermal processing, and improving the production efficiency during PCB reflow soldering and wave soldering. 3. The water absorption of the plate is greatly reduced. The water absorption of the traditional plate is 17-18 mg (GB/T4723), which has great influence on the thermal processing performance, dielectric performance, safety performance and storage of the plate. After the process is improved, the water absorption of the new plate of our company is controlled at about 8.5 mg (GB/T4723), which improves the heat and moisture resistance, chemical resistance, warping performance and dielectric performance of the plate, the influence factors of moisture absorption during thermal processing of the plate are reduced, the safety performance of electrical products is improved, and the adaptability range of the plate to the environment is increased. 4. The new type of plate adopts new materials for the production of the character surface of the plate, which improves the appearance grade of the plate and is comparable to the appearance of the same type of plate with the highest quality grade at home and abroad. The use of new materials to produce this type of plate, in the PCB processing process, the character surface screen leakage, will improve the ink adhesion, will not appear due to the plate surface is smooth and off the character, line problem, greatly improving the PCB processing production efficiency. Technical quality standard for this type of plate product: the PZ-23(G)F copper clad laminate developed by our company has obtained UL safety certification (file number: E249104). on the basis of CEPCP(G)-23F model standard in the implementation GB4724-92, the product performance can meet the requirements of American IPC4101A standard (American electronic circuit interconnection and packaging association standard): heat resistance 288 ℃/30S or more (meeting the requirements of lead-free environmental protection welding processing); warpage: &le; 0.4%; Punching performance: 5-5-5;CTI index: 300V and UV light blocking performance. The product performance and environmental protection indicators in line with the national standard and the EU ROHS, REACH directive requirements, the product performance and quality reached the domestic first-class level. Features features ● Excellent punching. The best punching temperature is 45-70 ℃ ● Good heat resistance and moisture resistance Excellentpunchingproperty, Excellentheatresistance Suitableforpunchingat45-70 ℃<!--[if!supportLists]-->●  <!--[endif]-->Meet the specification requirements of IPC-4101C/10 IPC-4101C/general characteristics test items TestItem unit test method TestMethod(IPC-TM-650) treatment conditions TestCondition specification value Specification(IPC-4101C) typical value TypicalValue copper foil peel strength PeelStrength(1oz.) n/mm2.4.8125 ℃ -1.75 Float260 ℃/10s &ge; 1.051.70 thermal stress/10s &ge; 1020 bow/warpage bow/Twist% 2.4.22.1a &le; 1.50.4/0.55 bending strength FlexuralStrengthN/mm22.4.4warp &ge; 242300fill &ge; 172240 flammability FlammabilityRatingUL94UL94UL94V-0V-0 surface resistance surface resistance m ω 2.5.17.1c -96/35/90 &ge; 1.0 × 1041.0 × 106 volume resistance/35/90 &ge; 1.0 × 1061.0 × 108 dielectric constant DielectricConstant -2.5.5.2Etched/@ 1MHZ &le; 5.44.5 dielectric loss LossTangent -2.5.5.2Etched/@ 1MHZ &le; 0.03512% arc absorption D-0.5 23 6.48% arc resistance &le; 0.50.25 Compared with leakage tracking index ComparativeTrankingIndexVIEC60112Etched/0.1%NH4CL &ge; 175175/300Z axis thermal expansion coefficient Z-AxisExpansionppm/℃ 2.4.24 E-2/105 TMA--100/320%-6.0Remarks: typicalvaluesforreferenceonly Note: Reference SpecimenThickness for Typical Value Production: 1.6mm 1/0A = Keep thespecimen originally without any process as it is, without treatment C = Temperature and humidity conditioning in constant temperature and humidity air D = Immersing in distilled water with temperature control immersed in constant temperature water E = Temperature conditioning in constant temperature air

Classification:

  • Product Description
  • PZ-23(G)F is a new type of PZ-23(G)F(UL:CEM-1) board developed by our company on the basis of the original PZ-23F board, combining the traditional CEM-1 board production process with self-innovation, adopting new plasticizing materials and high Tg epoxy resin, focusing on the requirements of PCB environmental protection lead-free welding and SMT automatic processing in recent years. This type of product has great quality advantages over the traditional board:

    1. The heat resistance of the product has reached 288 ℃/30S or more, which is more than 20s higher than that of the traditional plate.

    2. The warpage of the plate meets the IPC4101A (≤ 0.75%) standard, reaching and stabilizing below 0.5%, which is 0.3% lower than that of the traditional plate, reducing the bending probability of the plate during thermal processing, and improving the production efficiency during PCB reflow soldering and wave soldering.

    3. The water absorption of the plate is greatly reduced. The water absorption of the traditional plate is 17-18 mg (GB/T4723), which has great influence on the thermal processing performance, dielectric performance, safety performance and storage of the plate. After the process is improved, the water absorption of the new plate of our company is controlled at about 8.5 mg (GB/T4723), which improves the heat and moisture resistance, chemical resistance, warping performance and dielectric performance of the plate, the influence factors of moisture absorption during thermal processing of the plate are reduced, the safety performance of electrical products is improved, and the adaptability range of the plate to the environment is increased.

    4. The new type of plate adopts new materials for the production of the character surface of the plate, which improves the appearance grade of the plate and is comparable to the appearance of the same type of plate with the highest quality grade at home and abroad. The use of new materials to produce this type of plate, in the PCB processing process, the character surface screen leakage, will improve the ink adhesion, will not appear due to the plate surface is smooth and off the character, line problem, greatly improving the PCB processing production efficiency.

    Technical quality standards for this type of plate products:

    The PZ-23(G)F copper clad laminate developed by our company has obtained UL safety certification (file number: E249104). On the basis of CEPCP(G)-23F model standard in the implementation GB4724-92, the product performance can meet the requirements of American IPC4101A standard (American Electronic Circuit Interconnection and Packaging Association standard): heat resistance 288 ℃/30S or more (meeting the requirements of environmental protection lead-free soldering processing); Warpage: ≤ 0.4; punching performance: 5-5-5;CTI index: 300V and UV light blocking performance. The product performance and environmental protection indicators in line with the national standard and the EU ROHS, REACH directive requirements, the product performance and quality reached the domestic first-class level.

     

    Features Special Point

    ● Excellent punching. The optimum punching temperature is45-70℃ ●Good heat and moisture resistance

    Excellent punching property,Suitable for punching at 45-70             Excellent heat resistance

    CompliantIPC-4101C/10Specification requirements

    IPC-4101C/10 specification is applicable

    General Properties General characteristics

    Test Item

    Test Item

    Unit

    Unit

    Test Method

    Test Method

    (IPC-TM-650)

    Treatment conditions

    Test Condition

    Normative value

    Specification

    (IPC-4101C)

    Typical value

    Typical Value

    Peel strength of copper foil

    Peel Strength(1oz.)

    N/mm

    2.4.8

    125

    --

    1.75

    Float260/10s

    1.05

    1.70

    thermal stress

    Thermal Stress

    Sec

    2.4.13.1

    Float260/10s

    10

    20

    Bow degree/Warpage

    Bow/Twist

    %

    2.4.22.1

    A

    1.5

    0.4/0.55

    bending strength

    Flexural Strength

    N/mm

    2.4.4

    Warp

    242

    300

    Fill

    172

    240

    Combustibility

    Flammability

    Rating

    UL94

    UL94

    UL94 V-0

    V-0

    surface resistance

    Surface Resistivity

    MΩ

    2.5.17.1

    C- 96/35/90

    1.0× 104

    1.0× 106

    volume resistance

    Volume Resistivity

    MΩ-cm

    2.5.17.1

    C- 96/35/90

    1.0× 106

    1.0× 108

    dielectric constant

    Dielectric Constant

    2.5.5.2

    Etched/@1 MHZ

    5.4

    4.5

    dielectric loss

    Loss Tangent

    2.5.5.2

    Etched/@1 MHZ

    0.035

    0.02

    Arc resistance

    Arc  Resistance

    Sec

    2.5.1

    D-48/50 D-0.5/23

    60

    120

    water absorption

    Moisture Absorption

    %

    2.6.2.1

    D-24/23

    0.5

    0.25

    Compared with the tracking index

    Comparative Tranking Index

    V

    IEC60112

    Delayed/0.1% w4CL

    175

    175/300

    ZCoefficient of thermal expansion of shaft

    Z-Axis Expansion

    ppm/

    2.4.24

    E-2/105 TMA

    --

    100/320

    %

    --

    6.0

    Remarks:Typical values for reference onlyNote: Typical values are made for reference.  Specimen Thickness:1.6mm 1/0

    A = KeepTh ESUe specimenoriginallywithouanyprocess  Keep it as it is,No processing

    C =Temperature anhumidityconditioninConstant temperature and humidity in the airMediumProcessing

    D = Immersing in distillewater with temperature control  dip inConstantTreatment in warm water

     

    E =Temperature conditioninInConstant temperature air treatment

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