Products
Copper Clad Laminate PZ-22(G)F
Category:
Composite substrate
4000-888-086
Product Description
● Product description
|
Standard |
IPC Standard |
|
|
GB |
CPFCP(G)-22F |
|
|
Certification |
UL |
E249104 |
|
VDE |
40043981 |
|
|
CQC |
CQC03001006710 |
|
|
ROHS、REACH |
PASS |
● Product features
Products have: good heat resistance and moisture resistance, processing flatness and dimensional stability, suitable for punching and drilling processing; widely used in power supply substrates, household appliances, chargers, etc.
● General characteristics
|
Test Item |
Unit |
Test Method IPC-TM-650 |
Treatment conditions |
Normative value (IPC-4101C) |
Typical value |
|
Peel strength of copper foil (1oz.) |
N/mm |
2.4.8 |
125 ℃ |
-- |
1.65 |
|
Float260 ℃/10s |
≥ 1.05 |
1.60 |
|||
|
thermal stress |
Sec |
2.4.13.1 |
Float260 ℃/10s |
≥ 10 |
25-30 |
|
Bow/Warp |
% |
2.4.22.1 |
A |
≤ 1.5 |
0.4/0.55 |
|
bending strength |
N/mm2 |
2.4.4 |
Warp |
≥ 242 |
320 |
|
Fill |
≥ 172 |
260 |
|||
|
Combustibility |
Rating |
UL94 |
UL94 |
|
V1/V0 |
|
surface resistivity |
MΩ |
2.5.17.1 |
C- 96/35/90 |
≥ 104 |
1.4 × 109 |
|
volume resistivity |
MΩ-cm |
2.5.17.1 |
C- 96/35/90 |
≥ 106 |
3.3 × 109 |
|
dielectric constant |
― |
2.5.5.2 |
Etched/@1 MHZ |
≤ 5.4 |
4.6 |
|
dielectric loss |
― |
2.5.5.2 |
Etched/@1 MHZ |
≤ 0.035 |
0.025 |
|
Arc resistance |
Sec |
2.5.1 |
D-48/50 D-0.5/23 |
≥60 |
120 |
|
water absorption |
% |
2.6.2.1 |
D-24/23 |
≤0.5 |
0.09 |
|
Compared with the tracking index |
V |
IEC60112 |
Etched/0.1%NH4CL |
≥ 175 |
175 |
Note: Typical value reference: 1.6mm 1/0
● Purchasing information
|
Nominal area size |
2060x 1230,1230x 1030 ,1220x 1020 (other sizes negotiated) |
|
Dimensional tolerance |
3/-0 mm. |
|
Plate thickness |
1.0mm 1.2mm 1.5mm 1.6mm |
|
Straight angle |
max. 3mm as difference from diagonal measurement |
|
Red flag |
PZ |
|
Thickness of copper foil |
18, 25, 35, 70 µm (other copper foil thickness negotiation) |
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Hutouya Town Industrial Park, Laizhou City, Shandong Province
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